1 / 4 www.asb.co.kr november 2008 p lerow tm aln1950bt internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and lo w bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed match ing circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 1900 2000 gain db 13.2 14.2 gain flatness db ? 0.3 ? 0.4 noise figure db 0.8 0.85 output ip3 (1) dbm 30 31 s11 / s22 (2) db - 18 / - 9 output p1db dbm 1 6 17 switching time ? sec - supply current ma 25 35 supply voltage v 3.5 impedance ? 50 max. rf input power dbm c.w 23 ~ 25 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured wi th two tones at an output power of 0 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 2 rf in 5 rf out 6 +vcc other s ground ou t line drawing (unit: mm) feature s s 21 = 14.5 db @ 1900 mhz = 13.9 db @ 2000 mhz nf of 0.8 db over fr e quency u nconditionally stable single 3.5v supply high oip3 @ low current note: 1. the number and size of gr ound via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. description (recommended footprint) aln1950bt asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) c o u pl er website: www.asb.co.kr e - mail: sales@asb.co.k r tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion c o u pl er c o u pl er c o u pl er c o u pl er 1 - stage single type typ. @ t = 25 ? c, v s = 3.5 v, freq. = 1950 mhz, z o.sys = 50 ohm so lder stencil area specifications (in pr o duction)
2 / 4 www.asb.co.kr november 2008 p lerow tm aln1950bt internally matched lna module s - param e ters noise figure oip3 p1db 1900~2000 mhz +3.5 v typical performance (measured) s - parameters & k factor
3 / 4 www.asb.co.kr november 2008 p lerow tm aln1950bt internally matched lna module item vol t age s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) cur rent (ma) 4.5 - 18.3 - 9.8 14.1 0.4 0.819 15.5 27.6 13 4.6 - 18.9 - 10.1 14.3 0.4 0.810 15.8 28.7 15 4.7 - 19.5 - 10.4 14.4 0.4 0.801 16.1 29.7 17 4.8 - 19.6 - 10.6 14.5 0.4 0.792 16.3 30.7 20 4.9 - 20.0 - 10.8 14.6 0.4 0.785 16.6 31.6 22 5.0 - 20.3 - 11.0 14.7 0.4 0.781 16.8 31.9 25 5.1 - 20.3 - 11.0 14.8 0.4 0.783 17.1 32.3 27 5.2 - 20.3 - 11.1 14.8 0.4 0.784 17.3 32.9 30 5.3 - 20.4 - 11.3 14.9 0.4 0.788 17.6 33.0 33 5.4 - 20.4 - 11.4 14.9 0.4 0.796 17.8 33.2 36 5.5 - 20.4 - 11.2 14.9 0.4 0.794 18.0 33.4 38 i tem temp. s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current (ma) - 40 ? c - 22.0 - 10.8 14.8 0.4 0.492 17.2 31.9 20 - 20 ? c - 21.5 - 10.8 14.7 0.4 0.572 17.2 31.8 22 0 ? c - 21.0 - 10.9 14.7 0.4 0.648 17.0 32.1 23 25 ? c - 20.3 - 11.0 14.7 0.4 0.781 16.8 32.9 25 40 ? c - 19.8 - 10.9 14.6 0.4 0.840 16.7 32.3 26 60 ? c - 19.5 - 10.9 14.5 0.4 0.949 16.5 32.2 27 80 ? c - 19.0 - 10.8 14.4 0.4 1.028 16.3 32.0 27 100 ? c - 18.8 - 10.8 14.3 0.4 1.149 16.0 31.8 27 rf performance with voltage change rf performance with operating temperature
4 / 4 www.asb.co.kr november 2008 p lerow tm aln1950bt internally matched lna module 1) the tantal capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be dete r mined by customer s dc supply status. 2) so - called dc blocking capacitors are always necessarily placed at the input and output port for allo wing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are included inside the lna module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e quency. application circuit recommended soldering reflow process evaluation board layout + - aln out in c1 c2 tantal c a pacitor v dc 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) size 25 x 25mm in out +vcc (for aln - at, bt, t series C 10x10mm )
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